1

A new Cu(GeN x ) alloy film for industrial applications

Lin, Chon-Hsin
Journal:
Japanese Journal of Applied Physics
Year:
2014
Language:
english
File:
PDF, 2.00 MB
english, 2014
3

A new Cu(TiIrN x ) film with fine thermal conductivity and its application

Lin, Chon-Hsin
Journal:
Japanese Journal of Applied Physics
Year:
2014
Language:
english
File:
PDF, 754 KB
english, 2014
4

New Cu(TiIrN x ) Alloy Films for Solder Bump Flip-Chip Application

Lin, Chon-Hsin
Journal:
Japanese Journal of Applied Physics
Year:
2013
Language:
english
File:
PDF, 1.19 MB
english, 2013
6

Copper–Holmium Alloy Film for Reliable Interconnects

Lin, Chon-Hsin, Leau, Wen-Kuan, Wu, Cheng-Hui
Journal:
Japanese Journal of Applied Physics
Year:
2010
Language:
english
File:
PDF, 339 KB
english, 2010
7

New Cu(GeN x ) film in barrierless metallization for LED heat dissipation

Lin, Chon-Hsin
Journal:
Japanese Journal of Applied Physics
Year:
2015
Language:
english
File:
PDF, 3.72 MB
english, 2015
9

New Cu(AuTiN x ) copper alloy film and its features

Lin, Chon-Hsin
Journal:
Japanese Journal of Applied Physics
Year:
2016
Language:
english
File:
PDF, 1.73 MB
english, 2016
10

Some aspects of new Cu(NbC) films

Lin, Chon-Hsin
Journal:
Bulletin of Materials Science
Year:
2020
File:
PDF, 1.02 MB
2020
11

A new Cu(NbCNx) film and some of its characteristics

Lin, Chon-Hsin
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 2.33 MB
2020